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IEEE Netsoft 2020 :: 3rd Workshop on Advances in Slicing for Softwarized Infrastructures (S4SI). June-29, 2020 The current industry trend of convergence between computing and networking ecosystems highlights that computing, storage, and connectivity services, as well as any other present and future application instances, will be deployed in the form of virtualized assets within a software-defined infrastructures. All of these will be managed and made available under the cloud “as a Service” paradigm. One of the current trends in this space is the concept of a Slice. This has drawn much attention from many people interested in this important and developing area. Yet the topic of Slicing is very much fragmented across conceptual views, approaches, technologies, standardization, and so on. In its third edition, the S4SI workshop aims at bringing consolidation around slicing and discussing advances and challenges related to Slicing in Softwarized Infrastructures for faster and improved deployment of services in current and future 5G environments. There are clearly many open questions to be addressed, including: - Fragmented landscape and gaps, from concepts to standards towards multi-domain, end-to-end slicing; - How do the existing resource technologies of computing, storage and network can seamlessly be managed, orchestrated and controlled as part of end-to-end slices? - How end-to-end slices can automatically be defined and allocated on-demand – as a service – to host network services with similar requirements in terms of SLA and QoS; - What abstraction models, APIs and mechanisms would be required in order to implement slicing and what the tradeoff between complexity and performance would be; - How can cross-slice communication be orchestrated and set up in a secure and optimized manner in order to enable interactions between services deployed in co-located slices? S4SI aims at providing an international forum for researchers and practitioners from academia, industry, network operators, and service providers to discuss and address the challenges deriving from the emerging scenarios around Slicing where systems, processes, and workflows used in both computing and communications domains are converging. Altogether, S4SI seeks to improve the common understanding of Slicing, the expected benefits, including the new business model opportunities between slice providers and tenants. A concluding panel will contribute with a rich discussion on the lessons learned and the path ahead towards the consolidation of Slicing. The workshop welcomes contributions from both computing and network-oriented research communities, with the aim of facilitating discussion, cross-fertilization and exchange of ideas and practices, and successfully promote innovative solutions toward a real use of slices. Contributions that discuss insights and best practices, describe practical Slicing deployment and implementation experiences, and demonstrate innovative Slicing use-cases are especially encouraged. We are interested in papers that cover some of the following topics: - What is a Slice? What is an end-to-end Slice? - How are Slices formed and managed? In 5G? - Cross-domain Slicing, Federation, Exchanges - Issues in adapting existing systems for Slicing - Abstractions and models and APIs needed for a Slice? - How can slices be (de)allocated, and be elastic? - Network Slices with QoS/KPIs guarantees - Monitoring and Analytics systems for Slicing Best papers presented will be invited to submit an extended version for fast-track review in selected journals, e.g.:, IEEE Communications Magazine Series on Telecom Software, Network Virtualization, and Software Defined Networks. *** Important Dates *** -Paper Submission: February 14, 2020- Submission deadline extension to March 2nd, 2020 - Notification of Acceptance: March 23, 2020 - Camera ready: April 6, 2020 - Workshop date: June 29, 2020 *** Paper Submission *** Authors are invited to submit original contributions (written in English) in PDF format. Only original papers not published or submitted for publication elsewhere can be submitted. Papers should be up to 7 pages for Full, 4 pages for Short, excluding 1 page of references in IEEE 2-column US-Letter style using IEEE Conference template (see http://www.ieee.org/conferences_events/conferences/publishing/templates.html) and submitted in PDF format via: https://edas.info/newPaper.php?c=27006